Our Services
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
Continuous research and development efforts focus on service.
What Our Clients Have to Say
What Our Clients Have to Say
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Martin Landgraf
R & D Manager, Fraunhofer IPMS
“Hyperspectral imaging systems from DIVE provide the semiconductor industry with a new way of non-destructive testing of entire wafers. With support from Fraunhofer, DIVE is now making this innovative technology available for use in standard industrial cleanrooms, enabling significant productivity increases and cost reductions for semiconductor fabs.”
Frank Bösenberg
Managing Director, Silicon Saxony
“We're excited to have DIVE imaging systems as a member of Silicon Saxony. With their innovative technology, they are able to support the big semicon fabs in our network in their quest for a zero-defect production.”
Peter Friedrichs
Fellow SiC, Siltectra
“With the help of Hyperspectral Vision systems from DIVE, semiconductor manufacturing processes become comprehensible for the entire wafer surface. This matches perfectly to the high sophisticated wafer treatment processes at Siltectra.”
Dr. Dirk Drescher
Plant Manager, BOSCH Semiconductor Dresden
„The DIVE technology opens up a new dimension in surface metrology. It offers an innovative, expedited approach to uncovering and comprehending the intricate physics of thin film surfaces and interfaces.”
Peter Noelting
Senior Staff Engineer Tech Dev., Infineon Technologies Bipolar
„Together with DIVE, we are able to set up an incoming goods inspection that gives us direct information about further processing and necessary cleaning steps. In the future, we see an in-line application for Hyperspectral Vision as a target.“
Embrace the Future of Web3 and Blockchain
Let's collaborate to shape a future where opportunities are limitless.
Embrace the Future of Web3 and Blockchain
Let's collaborate to shape a future where opportunities are limitless.
Embrace the Future of Web3 and Blockchain
Let's collaborate to shape a future where opportunities are limitless.
Embrace the Future of Web3 and Blockchain
Let's collaborate to shape a future where opportunities are limitless.